- #0 Phillips screwdriver (magnetized)
- Torx T6 screwdriver (magnetized)
- Black stick (nylon probe 922-5065) (or other non-conductive nylon or plastic flat-blade tool
- Needle-point metal probe
- Multi-compartment screw tray (such as a plastic ice cube tray)
- Kapton tape (922-1731 (0.5-inch x 12-yard roll))
- Thermal grease (922-7144)
- Gasket kit (076-1206)
- Alcohol pads
Before you begin, remove the following:
- Battery.
- Memory
- Top case
- Right speaker
- Fans
- Optical drive.
PART LOCATION
- Disconnect the cables shown.
- Tape the thermal sensor cable to the display assembly to avoid forgetting it during assembly.
- Remove the screws.
- Warning: Do NOT allow the logic board to flex at any time. Flexing the board can crack solder joints to components. Give special attention at the narrow neck of the fan cutout.
- From the left side of the board, slowly begin to lift the board, avoiding any flexing, until the thermal material on the three chips underneath releases. Do not lift the board further.
- Note: The thermal material should easily release. If not, verify that all screws and connectors have been removed.
- Remove the connector under the board, shown. Do not remove the board just yet.
- The board has one more cable that must be disconnected before it can be removed.
- Carefully lift the left side of the board, supporting the board along its sides as it lifts, and pivot along the ports side as you pull it just clear of the port openings.
- Disconnect the thermal sensor cable.
- Remove the logic board.
- Warning: To avoid flexing the logic board, hold the board vertically along the wide sides. Do not hold the board by the ends or by the narrow neck at the fan cut out, or horizontally, as the board’s weight can cause excessive flex.
REPLACEMENT
- Verify that the EMI gaskets are in place along the port openings on the bottom case.
- If replacing the logic board, transfer the two screw guides along top edge of the board..
- If the logic board was removed to facilitate another procedure and will be re-installed:
- Use a black stick and alcohol wipes to clean the thermal grease from the three chips.
- Important: Use extreme care not to damage the chip or logic board components.
- Install EMI gaskets and tape on the ports from the gasket kit (076-1206)
- Transfer the logic board sleeves to the replacement board, if needed.
- Transfer the cosmetic shield, if needed.
- The thermal material must be replaced using the following procedures.
- Warning: Whenever the logic board is separated from the heat sink, the thermal grease must be replaced. Failure to do so can cause the computer to overheat and be damaged.
- Use a black stick to remove as much thermal grease as possible from the heat sink.
- Use an alcohol wipes to clean the mating surface.
- Important: Avoid unnecessary contact with new thermal material, as dirt and body oils reduce the material’s conductivity.
- Put a 0.2 - 0.3cc daub of thermal grease, in the center, on all three chip mating surfaces, as shown below.
- Note: One syringe of the thermal grease (922-7144) contains about 0.2 - 0.3 cubic centimeters (cc). So use one syringe per pad. If in doubt, use the picture below and apply a similar amount.
When replacing the logic board:
- Verify that the right speaker chamber is installed.
- Verify that the two plastic screw guides are installed on the top of the board.
- Connect the thermal sensor connector near the ports.
- Guide the logic board’s port side into the port openings on the bottom case.
- While lowering the board, connect the cable under the board on the left side.
- Verify that no cables are caught under the board when lowering into place.
- Attach the logic board screws.
- Verify that the Express Card cage flex connector is seated properly. If the connector on the flex is not lined up with the connector on the logic board, a bad connection with a characteristic bow, shown below, can occur.
- Reassemble and test all ports, components and functions of the computer.
- Note: After installing new thermal material, if you must briefly re-separate the logic board from the heat sink, it is OK to retain the same, new thermal material, as long as it is not handled excessively.
